|
| Thickness |
7.9-125
mil(0.2-3.2 mm)
|
| Inner
Foil |
0.5
, 1.0 , 2.0, .. 4.0 oz |
| Outer
Foil |
0.5
, 1.0 , 2.0 oz |
| Layers |
2-14
Layers1 |
| Drill
Hole Size |
Min
0.012"(0.3mm} |
| Trace
/ Space |
Min
4 mail / 4mail (0.1mm) |
| Solder mask Thickness |
300 - 1200u" (7 - 30
uM) |
| Hot Air Solder Leveling |
50 - 600u" (1.3 - 1.5
uM) |
| Gold Plating Thickness |
1 - 5 u" (0.025 - 0.12uM) |
| Nickel Plating Thickness |
100 - 200 u" (2.5 - 5
uM) |
| Delivery Size |
18" X 20" (450 -
508mm) |
| Aspect Ratio |
Up to 6 |
| Finish Process |
HAL |
| |
OSP(ENTEK, Enthone 106A) |
| |
Gold Plating |
|
|
