| ˇ@Thickness |
ˇ@7.9-125 mil(0.2-3.2 mm) |
| ˇ@Inner Foil | ˇ@0.5 , 1.0 , 2.0, .. 4.0 oz |
| ˇ@Outer Foil | ˇ@0.5 , 1.0 , 2.0 oz |
| ˇ@Layers | ˇ@2-14 Layers1 |
| ˇ@Drill Hole Size | ˇ@Min 0.012"(0.3mm} |
| ˇ@Trace / Space | ˇ@Min 4 mail / 4mail (0.1mm) |
| Solder mask Thickness | 300 - 1200u" (7 - 30 uM) |
| Hot Air Solder Leveling | 50 - 600u" (1.3 - 1.5 uM) |
| Gold Plating Thickness | 1 - 5 u" (0.025 - 0.12uM) |
| Nickel Plating Thickness | 100 - 200 u" (2.5 - 5 uM) |
| Delivery Size | 18" X 20" (450 - 508mm) |
| Aspect Ratio | Up to 6 |
| Finish Process | HAL |
| ˇ@ | OSP(ENTEK, Enthone 106A) |
| ˇ@ | Gold Plating |
ˇ@
